The unique Cascade e-Ion Plasma^TM allows for novel applications of Ions, Electrons, Radiation and Hot Gases, revolutionizing traditional processes such as brazing, hardfacing, sintering, general heating, 4DSintering^® and surface cleaning. The Cascade e-Ion Plasma's^TM CleanElectricFlame^® technology can often reduce 36 hour processes down to a few minutes.

Cascade CleanElectricFlame^® technology uses just electricity and air (or other gasses), leaving behind no residues. MHI's Cascade e-Ion Plasma^TM uses less energy, produces less noise and is safer than traditional heating methods. The e-Ion systems are available for use with plastics, metals, ceramics, composites and a number of other materials. The e-Ion devices can sinter titanium in minutes. Even copper and tungsten-copper alloys have shiny finish after e-Ion treatment

Cascade e-Ion Plasma Applications

• Rapid Thermal Processing (RTP) - Up to 200C/sec. Substrate Heat Up Rate
• Surface Modification (Polymeric, Ceramic, and Metallic Systems)
• Deposition Processes
• Brazing
• Thin Film Modification/Deposition
• Carbon Fiber Manipulation
• Die Heating
• Ceramic Drying
• Coupon Heating
• Debinding
• Soldering
• Others

Cascade e-Ion Plasma Advantages

• One Atmosphere Operation
• Clean Combustion
• No Consumables (air-in / air-out)
• Quiet Operation
• Wide Area Exposure
• Active Output (Ions, Electrons, Radiation, and Hot Gas)
• High Thermal Transfer
• Highly Efficient - Low Power Input
• Efficient, Cost Effective Alternative to Lasers, Induction, Electron Beam, and Other RTP technologies.