Licensing MHI Technologies
World leading possibilities for you. MHI licenses are creative. Often, fees are waived completely.
Products that transform great inventions into successful innovations
MHI offers licensing and integration planning services. By understanding your needs before licensing our technology, we are able to create the optimal configuration for your application. MHI doesn’t just license technology, we work with you throughout the integration process, ensuring that your operations will successfully utilize MHI’s patented technologies. When you succeed, MHI succeeds. MHI R&D, Engineering and Services also develop complete solutions for specific technical problems. |
MHI Inc.
750 Redna Terrace
Cincinnati, Ohio 45215 USA
Phone: 513-772-0404 Fax: 513-672-3333
contact us
Coatings (nano and micro on all substrates) |
Zapper™ FurnaceIntroducing the Rapid e-Ion Plasma Zapper™ Furnace.
12″ Wafers. Rapid Steel Heat Treating. Unparalleled 200K/s Heatup Rate.
Systems provide non-contact, continuous heating with accurate temperature control in compact versatile use designs. For knife-edge, wire and cable applications, systems can provide normalizing, stress relieving, annealing, hardening, curing, surface melting and coating. Processes can be completed while wire or cable is moving through the e-Ion Plasma™ environment. This type heating provides rapid high temperatures necessary to melt and heat treat. Much higher heat up rate compared to Induction. Easy Maneuverability of parts and all within 9kW of power – compare price with high power induction heating machines. Save on energy costs, lost productivity and benefit from higher quality products. No emissions, very low sound, no water cooling required. Are you in rapid-prototyping? Do you need wide area rapidly heating? Do you need quickness of heating and highly competitive productivity? (if yes to any of the questions please contact MHI to discuss e-Ion Plasma)
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Contact MHI to demonstrate technology. MHI will also create 10x productivity systems for your process. How? |